Computer housing

ABSTRACT

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/297,578, filed Jun. 5, 2014 entitled “COMPUTER HOUSING”, which claimsthe benefit of priority under 35 U.S.C §119(e) to:

(i) U.S. Provisional Application No. 61/832,698, filed Jun. 7, 2013 andentitled “COMPUTER ARCHITECTURE RESULTING IN IMPROVED COMPONENT DENSITYAND THERMAL CHARACTERISTICS”;

(ii) U.S. Provisional Application No. 61/832,709, filed Jun. 7, 2013 andentitled “INTERNAL COMPONENT AND EXTERNAL INTERFACE ARRANGEMENT FOR ACOMPACT COMPUTING DEVICE”;

(iii) U.S. Provisional Application No. 61/832,695, filed Jun. 7, 2013and entitled “ENCLOSURE/HOUSING FEATURES OF A COMPUTER FOR IMPROVEDTHERMAL PERFORMANCE AND USER EXPERIENCE”; and

(iv) U.S. Provisional Application No. 61/832,633, filed Jun. 7, 2013 andentitled “THERMAL PERFORMANCE OF A COMPACT COMPUTING DEVICE”, each ofwhich is incorporated herein by reference in its entirety for allpurposes.

This application is related to:

(i) International Patent Application No. PCT/US2014/041165, filed Jun.5, 2014 and entitled “COMPUTER SYSTEM”;

(ii) International Patent Application No. PCT/US2014/041160, filed Jun.5, 2014 and entitled “COMPUTER THERMAL SYSTEM”; and

(iii) PCT International Patent Application No. PCT/US2014/041153, filedJun. 5, 2014, and entitled “COMPUTER INTERNAL ARCHITECTURE”, each ofwhich is incorporated herein by reference in its entirety for allpurposes.

TECHNICAL FIELD

The embodiments described herein relate generally to compact computingsystems. More particularly, the present embodiments relate toorganization of structures and components and fabrication of enclosuressuitable for compact computing systems such as a desktop computer.

BACKGROUND

The outward appearance of a compact computing system, including itsdesign and its heft, is important to a user of the compact computingsystem, as the outward appearance contributes to the overall impressionthat the user has of the compact computing system. At the same time, theassembly of the compact computing system is also important to the user,as a durable assembly will help extend the overall life of the compactcomputing system and will increase its value to the user.

One design challenge associated with the manufacture of compactcomputing systems is the design of the outer enclosures used to housethe various internal components. This design challenge generally arisesfrom a number of conflicting design goals that include the desirabilityof making the outer enclosure or housing lighter, thinner, stronger, andaesthetically pleasing. Lighter housings or enclosures tend to be moreflexible and therefore have a greater propensity to buckle and bow,while stronger and more rigid enclosures tend to be thicker and carrymore weight. Unfortunately, the increased weight of thicker enclosuresmay lead to user dissatisfaction with respect to the overall appearancein that they may appear heavy and ill suited for placement on a desktopor in a server rack. However, thinner enclosures can be prone to bowingthat may damage internal parts or lead to other failures. Furthermore,the overall appearance of the compact computing system must beaesthetically pleasing as few consumers desire to own or use a devicethat is perceived to be ugly or unsightly. Due to such considerations,compact computing system enclosure materials are typically selected toprovide sufficient structural rigidity while also meeting weightconstraints as well as cooperate with thermal systems to maintainoperational components within acceptable thermal limits whilemaintaining any aesthetic appeal worked into materials that meet thesecriteria.

SUMMARY

The present application describes various embodiments regarding systemsand methods for providing a lightweight and durable compact computingsystem.

An enclosure for a computer system includes a housing having a housingthickness and having a longitudinal axis and comprises a cross sectionhaving a center point at a position on the longitudinal axis and thatencloses an internal volume that is symmetric about the longitudinalaxis.

Other apparatuses, methods, features and advantages of the inventionwill be or will become apparent to one with skill in the art uponexamination of the following figures and detailed description. It isintended that all such additional systems, methods, features andadvantages be included within this description, be within the scope ofthe invention, and be protected by the accompanying claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The included drawings are for illustrative purposes and serve only toprovide examples of possible structures and arrangements for thedisclosed inventive apparatuses and methods for providing compactcomputing systems. These drawings in no way limit any changes in formand detail that may be made to the invention by one skilled in the artwithout departing from the spirit and scope of the invention. Theembodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements.

FIG. 1 shows a perspective view of an embodiment of a compact computingsystem in a stand alone and upright configuration.

FIG. 2 shows a perspective view of another embodiment of a compactcomputing system in accordance with the described embodiments.

FIG. 3 shows a perspective view of a general system layout of thecompact computing system of FIG. 2.

FIG. 4A shows an exploded view of a compact computing system including ahousing and a central core, according to some embodiments.

FIG. 4B shows a partial view of an internal portion of the housing for acompact computing system, according to some embodiments.

FIG. 4C shows a cross sectional view of a housing for a compactcomputing system, according to some embodiments.

FIG. 5 shows a flowchart detailing a method for assembling a compactcomputing system inside a housing, in accordance with the describedembodiments.

FIG. 6A shows a rack arrangement suitable for supporting a number of thecompact computing systems.

FIGS. 6B-6D shows various other rack arrangements suitable forsupporting a number of compact computing systems.

FIG. 7 is a flowchart detailing a process in accordance with thedescribed embodiments.

FIG. 8 is a block diagram of a computing system suitable for use withthe described embodiments.

In the figures, elements having the same or similar reference numeralhave the same or similar function and description.

DETAILED DESCRIPTION

Representative applications of apparatuses and methods according to thepresently described embodiments are provided in this section. Theseexamples are being provided solely to add context and aid in theunderstanding of the described embodiments. It will thus be apparent toone skilled in the art that the presently described embodiments can bepracticed without some or all of these specific details. In otherinstances, well known process steps have not been described in detail inorder to avoid unnecessarily obscuring the presently describedembodiments. Other applications are possible, such that the followingexamples should not be taken as limiting.

The following relates to a compact computing system that can beconfigured as a stand-alone unit for placement upon or under a desk orother work area (also referred to as a desktop computer). The compactcomputing system can also be configured as part of a group of networkedor otherwise interconnected computers. In any case, the compactcomputing system can include a number of electronic components includingat least a central processing unit (CPU), and a graphics processing unit(GPU), and other primary and secondary components such a solid statememory devices, wireless components and so on. One or more internalelectronic component boards can be shaped to match a surface of theouter enclosure of the compact computing system, including for example,a circular shape to match a top or bottom of a cylinder, or a curvedshape to match a segment of an arc conforming to a curved exteriorsurface of the outer enclosure. In representative embodiments asdescribed herein, the compact computing system can be cylindrical inshape and can be configured to arrange a number of rectangularelectronic components as a central core providing a form factorcharacterized as having a high component packing density (a number ofcomponents per available volume). The resulting compact computing devicecan provide a high computing power density in a small, lightweight,transportable form factor. In some embodiments, the compact computingdevice can also be coupled to other compact computing devices to form amulti-computer system that can be used as a server computer system (suchas in a data farm) or as a network computing system having each compactcomputing device as a node (or nodes).

For example, in the embodiments described herein, the compact computingsystem can be cylindrical and be configured in such a way that therectangular electronic components can be assembled as a central corewith a form factor having a high component packing density (number ofcomponents per available volume). The central core can also have acylindrical shape in concurrence with a housing having an annularcylindrical shape along the lines of a tube. A thermal management systemcan utilize an air mover that can be move copious amounts of air axiallythrough an interior volume defined by the housing that can be used tocool a central core of the compact computing system in a manner that isboth efficient and quiet. Generally speaking, the air mover can providea volume of air per unit time in the form of an airflow of about 15-20cubic feet per minute (CFM) when major components such as a centralprocessing unit (CPU) and/or a graphics processing unit (GPU) are notbeing heavily utilized. However, when processing demand increases, theair mover can compensate for any increase in heat generated by rampingup the airflow. For example, in response to an increase in demand forprocessing resources from either or both the CPU and/or GPU, the airmover can increase the airflow from about 15-20 CFM to about 25-30 CFM(at about room temperature of 25° C.) with an acoustic output of about35 dbA (it should be noted that these acoustic levels are onlyexperienced when the air mover is performing at a higher end of itsoperating range during a period of high demand and not during morenormal operation). It should be noted that at higher ambient temperature(35° C.), the air mover can ramp the airflow even further to compensatefor the reduced thermal transfer at the higher ambient temperature. Inthis situation, the air mover can ramp the airflow to about 35 to 40 CFMor more having a higher acoustic output of 40 dbA or more.

The air mover can occupy a substantial amount of available crosssectional real estate defined by the housing providing an axial airflowsubstantially free of radial airflow components. Moreover, componentsthat make up the central core can be aligned in an axial manner thatmaximizes an amount of surface area in thermal contact with the axialairflow. Furthermore, the design and layout of the components can alsobe axial in nature further enhancing the available heat transfercapability and component packing density that leads to higher computingpower density (computing operations per available volume). For example,an integrated circuit can be designed to have a power input node (s) ata first end of the integrated circuit and data I/Os at an opposite endof the integrated circuit.

The compact computing system can also be coupled to other compactcomputing systems to form a multi-computer system that can be used as aserver computer system (such as in a data farm) or as a networkcomputing system having each compact computing system as a node (ornodes). One advantage of the compact size and shape of the compactcomputing system is that a simple racking system (along the lines of awine rack configuration) can be used to position the multiple connectedcompact computing systems. For example, the individual compact computingsystems can be placed at an angle within a rack arrangement in such away as to provide easy access to inputs as well as outputs forconnection to other devices without restricting the flow of air into orout of the compact computing system. In some cases, the individualcompact computing systems can be stacked in an alternating arrangementthat also does not restrict either air intake or air exhaust. These andother general subjects are set forth in greater detail below.

In a particular embodiment, the compact computing system can include ahousing that can surround and protect the central core. The housing canbe easily removed for servicing or other access. The housing can beformed of aluminum having an aluminum oxide (alumina) layer that bothprotects the housing and promotes radiative cooling. The aluminumoxide/anodization layer also improved heat rejection from externalsurface of the housing by increasing its infrared radiative emissivity.Aluminum has a number of characteristics that make it a good choice forthe housing. For example, aluminum is a good electrical conductor thatcan provide good electrical ground and it can be easily machined and haswell known metallurgical characteristics. The superior conductivity ofaluminum provides a good chassis ground for internal electricalcomponents arranged to fit and operate within the housing. The aluminumhousing also provides a good electromagnetic interference (EMI) shieldprotecting sensitive electronic components from external electromagneticenergy as well as reducing leakage of electromagnetic (EM) energy fromthe compact computing system. A layer of aluminum oxide can be formed onthe surface of the aluminum in a process referred to as anodization. Insome cases, the layer of aluminum oxide can be dyed or otherwise imbuedwith a color(s) to take on a specific color or colors. It should benoted that since aluminum oxide is a good electrical insulator, eitherthe interior surface of the housing is masked during the anodizationprocess to preserve access to the bulk material or selected portions ofthe layer of aluminum oxide are removed to provide good electricalcontacts.

In one embodiment, the cylindrical housing can take the form of a singlepiece housing (monolithic). In this way, the cylindrical housing appearsseamless and homogenous. The cylindrical shape of the housing maximizesthe ratio of internal volume and enclosure volume. In one embodiment,the housing is formed of a single billet of a strong and resilientmaterial such as aluminum that is surface treated (anodized) to providean aesthetically pleasing appearance. A top portion of the cylindricalhousing is formed into the lip used to engage a circumferential portionof the airflow that travels in an axial direction from the first openingto the second opening at which point the airflow passes to an externalenvironment. The lip can also be used to transport the compact computingsystem using for example, a hand.

In a particular embodiment, a compact computing system can be assembledusing a bottom up type assembly. Initial assembly operations can includeinstalling a vapor chamber on each side of a triangular central corestructure. In the described embodiments, the vapor chamber can take onthe form of a two phase (vapor/solid) heat spreader. In a particularimplementation, the core can take the form of an aluminum frame securedto and cradled within a fixture. High power components, such as agraphic processor unit (GPU) and/or central processor unit (CPU) can bemounted directly to the vapor chambers.

A good thermal contact can be formed between the vapor chambers and thehigh power components using a thermally conductive adhesive, paste, orother suitable mechanism. A main logic board (MLB) can be pressedagainst a CPU edge connector followed by installation of a GPU flex(es).Once the MLB is seated and connected to the CPU and GPU, memory modulescan be installed after which an inlet assembly can be installed andcoupled to the core structure using fasteners. An input/output (I/O)assembly that has been independently assembled and pre-tested can beinstalled after which a power supply unit (PSU) control cable can beconnected to the MLB followed by connecting the DC PSU power using a busbar system. An exhaust assembly can be installed followed by connectinga RF antenna flex to an I/O board.

As noted above, the housing can take on many forms, however, for theremainder of this discussion and without loss of generality, the housingtakes on a cylindrical shape that encloses and defines a cylindricalvolume. In the described embodiment, the housing and the correspondingcylindrical volume can be defined in terms of a right circular cylinderhaving a longitudinal axis that can be used to define a height of theright circular cylinder. The housing also can be characterized as havinga circular cross section having a center point on the longitudinal axis.The circular cross section can have a radius that extends from thecenter point and is perpendicular to the longitudinal axis. In oneembodiment, a thickness of the housing can be defined in terms of arelationship between an inner radius (extending from the center point toan interior surface of the housing) and an outer radius (extending fromthe center point to an exterior surface of the housing).

The housing can have a thickness tuned to promote circumferential andaxial conduction that aids in the spreading out of heat in the housingthereby inhibiting formation of hot spots. The separation between thecentral core and the housing allows an internal peripheral airflow tocool the housing helping to minimize a touch temperature of the housing.In one embodiment, the housing can be mated to a base unit thatprovides, in part, a pedestal used to support the compact computingsystem on a surface. In one embodiment, the base unit can be a removablebase unit. The housing can include a first opening having a size andshape in accordance with the base unit. The first opening can be a fullperimeter air inlet whose circular design allows for functionality evenin those situations where the compact computing system is located in acorner or against a wall. In an assembled configuration, the base unitcorresponds to a base of the cylinder. The first opening can be used toaccept a flow of air from an external environment passing through ventsin the base unit. The amount of air that flows into the housing isrelated to a pressure differential between the external environment andan interior of the compact computing system created by an air moverassembly near a second opening axially disposed from the first opening.A thermal management system can utilize the air mover that can be movecopious amounts of air axially through an interior volume defined by thecylindrical housing that can be used to cool the central core in amanner that is both efficient and quiet.

In one embodiment, an air exhaust assembly can take the form of a fanassembly. The fan assembly can be an axial fan assembly configured toaxially move air through the housing by creating the abovementionedpressure differential. The fan assembly can also be configured as amixed air fan assembly providing both axial and centrifugal componentsto air as it exits the fan assembly. In one embodiment, the fan assemblycan occupy a substantial portion of available cross sectional area ofthe cylindrical housing. For example, the fan assembly can account forat least 85% or thereabouts of an available cross sectional area of aninterior of the housing. In any case, air can enter through the vents inthe base unit. In one embodiment, a baffle arrangement can bifurcate(split) the airflow in such a way that some of the airflow remainswithin a central column separate from a peripheral airflow located awayfrom the central column. The central column of air can thermally engagea heat sink structure on which internal components can be mounted. Inorder to optimize thermal transfer, components can be configured andmounted axially (in the direction of air flow) in order to maximize anamount of air engaging the components. In this way, both the centralairflow and the peripheral airflow can be used to cool the central coreand still maintain the housing at an acceptable temperature.

The housing can include an exhaust lip at the second opening. Theexhaust lip can be arranged to engage a portion of the air as it flowsout of the second opening having the effect of directing the airflow(and sound) away from the user. The exhaust lip can also provide anintegrated handle structure suitable for grasping the compact computingsystem. The housing can have a thickness that is tuned by which it ismeant that the housing has a varying thickness in which a portion of thehousing nearest the exhaust lip is thicker than that portion away fromthe exhaust lip. The thickness of the housing can be varied in a mannerthat promotes an axial and circumferential conduction of heat in thehousing that promotes a more even distribution of heat that inhibits theformation of hot spots in the housing.

A good electrical ground (also referred to as a chassis ground) can beused to isolate components that emit significant electromagnetic energy(such as a main logic board, or MLB) from those circuits, such aswireless circuits, that are sensitive to electromagnetic energy. Thisisolation can be particularly important in the compact computing systemdue to the close proximity of components that emit electromagneticenergy and those components that are sensitive to electromagneticenergy. Moreover, the housing can include conductive material (such as agasket infused with conductive particles) that can be mated to acorresponding attachment feature on the base unit completing theformation of a Faraday cage. The Faraday cage can block electromagneticenergy (both internal and external) effectively shielding the externalenvironment from EMI generated by the compact computing system (and theinternal environment from externally generated EMI). In order tocomplete the Faraday cage, air vents in the base unit can be sized toeffectively block electromagnetic energy having selected wavelength.More specifically, the wavelength of electromagnetic energy blocked bythe vents can be consistent with that emitted by active components withthe compact computing system.

In one embodiment, the compact computing system can include a sensorconfigured to detect whether or not the housing is properly in place andaligned with respect to the internal components. Proper placement of thehousing is important due to the key role that both the shape andconfiguration of the housing has with respect to thermal management ofthe compact computing system as well as completing the Faraday cagediscussed above. The compact computing system can include an interlocksystem that detects the presence and proper alignment of the housingwith respect to the internal components. Only when the proper alignmentis detected, the interlock system will allow the internal components topower up and operate in a manner consistent with system specification.In one embodiment, the interlock system can include a magnetic elementdetectable by a Hall effect sensor only when the housing is in a properposition and alignment with respect to the internal components.

Due at least to the strong and resilient nature of the material used toform the housing; the housing can include a large opening having a spanthat does not require additional support structures. Such an opening canbe used to provide access to an input/output panel and power supplyport. The input/output panel can include, for example, data portssuitable for accommodating data cables configured for connectingexternal circuits. The opening can also provide access to an audiocircuit, video display circuit, power input, etc. In one embodiment,selected data ports can be illuminated to provide easier access inreduced lighting.

These and other embodiments are discussed below with reference to FIGS.1-8. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these figures is forexplanatory purposes as the invention extends beyond these limitedembodiments.

FIG. 1 shows a perspective view of compact computing system 100. Compactcomputing system 100 can have a shape defined by housing 102. In thedescribed embodiments, housing 102 can be cylindrical in shape having afirst opening 104 characterized as having diameter d₁. Morespecifically, housing 102 can take the form of a circular right cylinderhaving a longitudinal axis that extends long a centerline of a centralvolume enclosed by housing 102. Housing 102 can be characterized ashaving a circular cross section having a center point coincident with acorresponding point on the longitudinal axis. The circular cross sectionhas a radius that is perpendicular to the longitudinal axis and extendsoutwardly therefrom. Accordingly, thickness t of housing 102 (morespecifically a housing wall) can be defined as a difference between anouter radius r_(o) associated with an exterior of housing 102 and innerradius r_(i) associated with an interior surface of housing 102.Moreover, housing 102 can include second opening 106 axially disposedfrom first opening 104 having diameter d₂ defined in part by exhaust lip108 where d₁ is at least equal to or greater than d₂. Housing 102 can beformed from a single billet of aluminum in the form of a disk that canbe extruded in a manner forming exhaust lip 108. Thickness t of housing102 can be tuned to mitigate hot spots. In this regard, housing 102 canhave a non-uniform thickness t. In particular, portion 110 near exhaustlip 108 can have a first thickness of about 4-6 mm that then changes toa second thickness associated with portion 112 that is reduced from thefirst thickness and located away from exhaust lip 108. In this way,portion 110 can act as both an integrated handle used to grasp compactcomputing system 100 and as a feature that absorbs and conducts thermalenergy transferred from a portion of exhaust airflow 114 that engagesexhaust lip 108. Through radiative and conductive heat transfer and bylimiting the amount of heat transferred to portion 112, the formation oflocal hot spots in housing 102 can be mitigated. Tuning the thickness ofhousing 102 can be accomplished using, for example, an impact extrusionprocess using a metal disk that is then machined to the desiredthickness profile. The metal disk may be made of aluminum, titanium, andany other metallic material that provides the strength, thermalconductivity, and RF-isolation desired. The extrusion process forms acylinder that is machined in the exterior portion and in the interiorportion to acquire the desired cross sectional profile and also thedesired visual appeal from the exterior.

Compact computing system 100 can further include base unit 116. Baseunit 116 can be used to provide support for compact computing system100. Accordingly, base unit 116 can be formed of strong and resilientmaterial along the lines of metal that can also prevent leakage ofelectromagnetic (EM) energy from components within compact computingsystem 100 that radiate EM energy during operation. Base unit 116 canalso be formed of non-metallic compounds that can nonetheless berendered electrically conductive using, for example, electricallyconductive particles embedded therein. In order to assure that anyelectromagnetic energy emitted by components within compact computingsystem 100 does not leak out, lower conductive gasket 118 can be used tocomplete a Faraday cage formed by base unit 116 and housing 102. Upperconductive gasket 120 (shown in more detail in FIG. 3) can be disposedon the interior surface of housing 102 near a lower edge of portion 110.Use of conductive gaskets 118 and 120 to complete the Faraday cage canincrease EMI isolation by about 20 dB.

Base unit 116 can also include vents 122. Vents 122 can be dual purposein that vents 122 can be arranged in base unit 116 in such a way that asuitable amount of air from an external environment can flow throughvents 122 in the form of intake airflow 124. In one embodiment, intakeairflow 124 can be related to a pressure differential across vents 122created by an air mover disposed with compact computing system 100. Inone embodiment, the air mover can be disposed near second opening 106creating a suction effect that reduces an ambient pressure withinhousing 102. In addition to facilitating intake airflow 124, vents 122can be sized to prevent leakage of electromagnetic energy there through.The size of vents 122 can be related to a wavelength corresponding toelectromagnetic energy emitted by internal components.

It should be noted that although a cylindrical housing is shown, thatnonetheless any suitably shaped housing can be used. For example,housing 102 can be have a rectangular cross section, a conical crosssection (of which the circle is only one), or the cross section can takethe form of an n-sided polygon (of which the rectangle is one in whichn=4 and a triangle where n=3) where n is an integer having a value of atleast 3.

FIG. 2 shows another embodiment of compact computing system 100 in theform of compact computing system 200. It should be noted that compactcomputing system 200 can be substantially the same or similar as compactcomputing system 100 with respect to size and shape of housing 102.Compact computing system 200 can include housing 202 that can differfrom housing 102. In this embodiment, housing 202 can include opening204 having a size and shape in accordance with interface panel 206.Interface panel 206 can include various ports used for communication ofdata between compact computing system 200 and various external circuits.For example, interface panel 206 can include audio jack ports 208 thatcan be used to provide an audio stream to an external audio circuit,such as a headphone circuit, audio processor, and the like. A set ofdata ports 210 can be used to transfer data of various forms and/orpower between an external circuit(s) and compact computing system 200.Data ports 210 can be used to accommodate data connections such as USB,Thunderbolt®, and so on. For example, the set of data ports 210 caninclude data ports 212 in the form of USB ports whereas data ports 214can take the form of Thunderbolt® ports. In this way, compact computingsystem 200 can be interconnected to other computing systems such as datastorage devices, portable media players, and video equipment, as well asto form a network of computing systems. Furthermore, data ports 216 cantake the form of Ethernet ports suitable for forming communicationchannels to other computing systems and external circuits whereas dataport 218 in the form of an HDMI port can be used for audio/video (AV)data transport. In this way, data port 218 can be used to stream highspeed video between compact computing system 200 and an external videomonitor or other video processing circuitry. Accordingly, interfacepanel 206 can be used to form connections to a large number and varietyof external computing systems and circuits which is particularly usefulin those situations where a large amount of computing resources arerequired without the high capital costs associated with large mainframetype computers. Moreover, the compact size and shape of compactcomputing system 200 also lends itself to space efficient computingnetworks, data farms, and the like.

Interface panel 206 can be made of a non-conductive material toelectrically insulate each of the ports from one another and fromhousing 202. Accordingly, interface panel 206 may include a plasticinlay dyed to provide a cosmetic appeal to computing system 200. Forexample, in some embodiments interface panel 206 is dyed with a black ordark tint. Below the surface of interface panel 206, a conductive websupported by a conductive gasket maintains a Faraday cage for RF and EMIinsulation formed between housing 202 and upper and lower conductivegaskets (118, 120) located at an interior surface of housing 202. Poweron/off button 220 can be readily available to accept a user touch forinitiating a power on sequence (including, for example, boot up process)as well as a power down sequence. Power input port 222 can be sized andshaped to accept a power plug suitable for transferring external powerto operational components within housing 202. In some cases, compactcomputing system 200 can include internal power resources (such as abattery) that can be charged and re-charged in accordance with powerdelivered by way of power input port 222.

Housing interlock opening 224 can be accommodate housing interlock 226used to secure housing 202 to internal structures of compact computingsystem 200. Housing interlock 226 can take the form of a sliding latchor other such mechanism that can be manually engaged and disengaged. Inthis way, housing 202 can be easily removed in order to expose internalcomponents and structures for servicing, for example. It should be notedthat although not shown, a detection circuit can be used to detect ifhousing 202 is properly in place with respect to internal components andstructures. This is particularly important since thermal management ofcompact computing system 200 relies to a large degree on the presenceand proper placement of housing 202. Therefore, it is desired that if itis determined that housing 202 is not in proper placement or alignmentwith respect to internal structures or components, then the detectioncircuit will prevent compact computing system 200 from operating, or atleast operating at full capacity. In one embodiment, the detectioncircuit can include a magnetic sensor (such as a Hall Effect device)located to detect a magnet(s) disposed on housing 202 only when housing202 is properly placed and aligned.

Removing housing 202 can expose a central core of compact computingsystem 200. More specifically, FIG. 3 shows central core 300 of compactcomputing system 200 absent housing 202. Central core 300 can include acomputing engine having computational components and a heat sink thatcan be used as a framework used to support at least some of thecomputational components. In this way, the computing engine takes on aform factor in accordance with that of the heat sink. Accordingly, thecylindrical shape of compact computing system 200 dictates thearrangement of various internal components as well as requirements forthermal management. For example, internal components can be arranged inan axial manner that optimizes both a component packing density (thenumber of operational components per available volume) and a computingpower density (computing power per available volume). Moreover, theaxial arrangement of internal components also optimizes an amount ofheat that can be transferred to intake airflow 124 from the internalcomponents and removed by way of exhaust airflow 114. (It should benoted that, in general, the nature of compact computing system 200provides that intake airflow 124 be about the same as that of exhaustair flow 114.)

For example, memory module 302 can be formed of substrate 304 on whichis mounted memory device 306. Substrate 304 can have major axis 310 thatis parallel to peripheral airflow 312. In order to optimize heattransfer from memory device 306 to peripheral airflow 312, memory device306 can be mounted onto substrate 304 in a manner that maximizes athermal transfer interface with peripheral airflow 312. For example,each memory device can have a shape corresponding to a minor dimension(representing a width W, for example) and a major dimension (representedby a length L, for example). In the embodiment shown, the minordimension W of memory device 306 is aligned generally parallel toperipheral airflow 312. In this way, a thermal transfer interface formedbetween peripheral airflow 312 and memory device 306 disposed on memorymodule 302 can be optimized. It should also be noted that peripheralairflow 312 is constrained by the presence of housing 202 to flow in aperipheral region defined by an interior surface of housing 202 andcentral core 300. Moreover, peripheral airflow 312 can be characterizedas having substantially no radial components thereby further enhancingthe heat transfer capability of peripheral airflow 312 with respect tomemory module 302 and memory device 306. In this way, the axialcomponents of peripheral airflow 312 align with the minor dimension W ofmemory device 306. It should be noted that intake airflow 124 is splitinto peripheral airflow 312 and central airflow 314 (not shown) thatflows within a central portion of the central core 300. Accordingly,peripheral airflow 312 and central airflow 314 are combined formingexhaust airflow 114 prior to passing out of compact computing system 200through second opening 106.

In the described embodiment, air mover 320 can be disposed in proximityto second opening 106 (cf. FIG. 1). It should be noted that air mover320 can combine the central airflow 314 and peripheral airflow 312 backinto exhaust airflow 114. Air mover 320 could include air exhaustassembly 322 that can be used to direct exhaust airflow 114 throughsecond opening 106 at least some of which engages with exhaust lip 108in a manner that facilitates the transfer of thermal energy generated byinternal components of compact computing system 200. Air exhaustassembly 322 includes vents 324 to allow exhaust airflow 114 to passthrough. Cosmetic shield 326 can be used to cover operational componentssuch as RF circuits and antenna. In this regard, cosmetic shield 326 canbe formed of RF transparent material such as plastic, ceramic, or othernon-conductive materials.

Due to the electrically conductive nature of housing 202, housing 202can be used as a chassis ground to provide a good ground for internalcomponents. Accordingly, touch points 328 can be formed of conductivematerial and be used to form a conductive path between internalcomponents and an interior of housing 202. It should be noted that inorder to make a good electrical connection, portions of housing 202contacting touch points 328 are devoid of any non-conductive orinsulating material (such as aluminum oxide). Therefore, in those caseswhere housing 202 has an aluminum oxide layer formed thereon, selectedportions of the aluminum oxide are removed (or that portion of housing102 masked during the anodization operation) to expose bulk material inthose locations that come into contact with touch points 328. Asdiscussed above, in order to prevent leakage of electromagnetic energy,housing 202 and base unit 116 forms a Faraday cage.

In order to provide a user-friendly interaction with compact computingsystem 200, central core 300 may include sensors such as accelerometersdisposed on a plurality of points. Thus, as the user handles housing 202in order to position compact computing system 200 in a convenientlocation and orientation, illumination patterns can be used to highlightaspects of interface panel 206 so as to make portions of interface panel206 more visible to the user. Accordingly, some of the sensors mayinclude light sensing devices to determine whether or not there issufficient ambient illumination for the user to see selected items oninterface panel 206.

FIG. 4A shows an exploded view 400 of compact computing system 200including housing 202 and central core 300. Central core 300 includesair mover 320, computing engine 402, and base unit 116. Central core 300may also include a Power Supply Unit (PSU) 404 coupled to interfacepanel 206 on the outside surface (facing the user). Computing engine 402includes heat sink 406 for heat exchange with central air flow 314. Heatsink 406 has a cross section can take the form of an m-sided polygon (ofwhich the rectangle is one in which m=4 and a triangle where m=3) wherem is an integer having a value of at least 3 (that may or may not beequal to n), the sides of the polygon forming a base for mountingprocessor boards such as CPU board and GPU boards. In other words, thereare many geometric arrangements and relationships that are suitablebetween housing 102 and the central core 300. Heat sink 406 may alsoinclude a plurality of vertical members (or ‘stanchions’) 408 along thevertex of the polygonal cross section. Vertical members 408 may includeattachment features so that a fastener (e.g., through holes for a screw)may attach base unit 116 and air mover 320 to computing engine 402 toform central core 300.

It should be noted that in a specific embodiment, heat sink 406 includesplanar faces 407 that define a central thermal zone having a triangularcross section. Heat sink 406 also includes at least one cooling fin 409that extends longitudinally at least part of a length of a correspondingplanar face and spans the central thermal zone. Moreover, a centercooling fin extends from a first planar face to a junction of a secondplanar face and a third planar face and bisects the central thermal zoneinto a first region and a second region each having similar triangularcross sections. Furthermore, a first cooling fin different from thecentral cooling fin extends from the first planar face to the secondplanar face and spans the first region whereas a second cooling findifferent from the first cooling fin and the central cooling fin extendsfrom the first planar face to the third planar face and spans the secondregion. In the described embodiment, a first angle between the firstcooling fin and the first planar face varies in accordance with adistance between the first cooling fin and the center cooling fin and asecond angle between the second cooling fin and the first planar facevaries in accordance with a distance between the second cooling fin andthe center cooling fin such that a summation of the first angle and thesecond angle is equal to about 180°.

In some embodiments, computing engine 402 includes main logic board(MLB) 410. Accordingly, MLB 410 may be formed in a circular printedcircuit board (PCB), on a plane substantially orthogonal to thelongitudinal axis of housing 202. Computing engine 402 may have apolygonal cross-section (such as a triangle described above) such thatthe polygon is inscribed in the circular cross-section of housing 202.For example, as shown in FIG. 4A, computing engine 402 may have atriangular cross section wherein a base of the triangle corresponds witha diameter of the circular cross-section of housing 202 whereas theother two sides of the triangle each form a cord of the circularcross-section of housing 202. Air mover 320 may include surface 412 forelectrically coupling to upper conductive gasket 120. Surface 412 can belaser etched to provide a good fit with upper conductive gasket 120providing a good seal. Thus, RF antennas in the top portion of air mover320 (enclosed by cosmetic shield 326) are electrically insulated from RFand EMI signals through the bottom side of air mover 320.

Air mover 320 may include an indentation 416 for receiving the top edgeof an interface structural wall 418. Air mover 320 also includes aplurality of attachment features 420 for attaching air mover 320 tocomputing engine 402 (e.g., holes). Interface structural wall 418supports interface panel 206 (cf. FIG. 2). In order to insulate centralcore 300 from RF-radiation and EMI, interface structural wall 418 mayinclude a layer of a conductive material, such as aluminum. In thatregard, the layer of conductive material in interface structural wall418 may have a thickness that provides adequate RF and EMI insulation.In some embodiments, structural wall 418 may include an aluminum layerthat is no less than 10 μm thick. For example, the thickness of thealuminum layer in interface structural wall 418 may be about 100 μm, ormore. Structural wall 418 includes a housing latch lead-in feature 422and a housing latch locking feature 424. Base unit 116 includes ribs426, and an indentation 428 for receiving the bottom edge of interfacestructural wall 418. Indentation 428 may be a grooved portion along atop perimeter of base unit 116.

Housing 202 can slide down over central core 300 and stops at base unit116, completing assembly of compact computing system 200. On the bottomend of housing 202, lower conductive gasket 118 couples housing 202 tobase unit 116. In some embodiments, lower conductive gasket 118 can havean outer diameter slightly greater than the inner diameter of housing202. Thus, once housing 202 is lowered down onto base unit 116, theweight of housing 202 presses onto lower conductive gasket 118 resultingin a concentric bias to housing 202 that also secures housing 202 inposition. Once in place, housing 202 causes formation of a peripheralair gap between vents 122 and the inside surface of housing 202.

Housing 202 is an integral part of the thermal management operation ofcompact computing system 200 by forming in effect a chimney forperipheral airflow 312 (cf. FIG. 3). In some embodiments, housing 202also provides RF and EMI insulation to electronic components andcircuitry in central core 300. In that regard, some embodiments ofcompact computing system 200 are fully operational once housing 202 isin place. Accordingly, some embodiments may include sensors mounted oncentral core 300. The sensors may be configured to enable the operationof compact computing system 200 only once housing 202 is secured inplace. For example, the sensor may include a Hall effect sensor, themagnet placed in an interior face of housing 202. Thus, when housing 202is in place, the sensor is engaged and compact computing system 200 isenabled. Further, housing 202 provides a cosmetic profile to compactcomputing system 200 that makes it appealing for users, thus enhancingthe marketability of the device. In some embodiments, housing 202 mayalso serve as a handle for compact computing system 200, through exhaustlip 108 and the gap formed between air mover 320 and portion 110. Inthat regard, housing 202 allows a user to carry compact computing system200 from one place to another. The round, omnidirectional format ofhousing 202 also allows the user to rotate compact computing system 200in order to have interface panel 206 face a desired direction.

FIG. 4B shows a partial view of an internal portion of housing 202,according to some embodiments. The interior surface of housing 202includes an anodized aluminum layer such that the outside surface ofhousing 202 is electrically insulated from circuitry inside central core300. This enables the function of housing 202 as a Faraday cage for RFand EMI insulation of circuitry in central core 300. In someembodiments, a ground may be coupled between the outside surface ofhousing 202 and central core 300. Conductive stripes 430 may be laseretched on the anodized interior face of housing 202. Thus, stripes 430reveal a bulk portion of the conductive layer forming housing 202.Conductive stripes 430 electrically couple touch points 328 to theconductive layer in housing 202, aiding in the formation of a Faradaycage providing RF and EMI insulation to circuitry in central core 300.FIG. 4B also illustrates bottom laser etched surface 432. Latch 434 isactuated by the user to fit into latch locking feature 436 so that latch434 meets locking feature 436. By rotating housing 202 about centralcore 300, a user may find the proper orientation prior to ‘dropping’housing 202 into a ‘locked’ position. In some embodiments, a Hall effectsensor identifies that housing 202 is in a locked position and enablesthe circuitry to be powered ‘on’. It should be noted that an I/Oillumination feature can activate (e.g., light up with illumination)even if housing 202 is not in a locked configuration. In someembodiments, sensors (such as an accelerometer) and I/O illuminationcircuitry can be active and operable regardless of whether housing 202is in a locked configuration. In one embodiment, compact computingsystem 200 can be prevented from operating, or at least operating atfull capacity, when housing 202 is not locked with respect to base 116.

FIG. 4C shows a cross sectional view 450 of housing 202 along line A-Aof FIG. 4A for compact computing system 200. Portion 110, opening 106,exhaust lip 108, upper conductive gasket 120, opening 104, and heat sink406 have been discussed in detail above. Accordingly, top portion 110has a thickness t₁ that is greater than thickness t₂ of a portion 112 ofhousing 202. A thicker top portion 110 reduces the thermal impact onhousing 202 by airflow 114 as it engages portion 110 by way of exhaustlip 108. In embodiments having housing 202 made of a thermallyconductive material such as a metal (e.g., aluminum), a thicker layer ofmaterial increases the heat flow out of portion 110. FIG. 4C shows anillustrative example where thickness t gradually decreases from amaximum value t₁ at exhaust lip 108 down to a reduced value t₂ inportion 112.

FIG. 5 shows a flowchart detailing a method 500 for assembling a compactcomputing system inside a housing, in accordance with the describedembodiments. The compact computer may include a central core having aprocessor assembly, a base unit, and an air mover (central core 300,computing engine 402, base unit 116, and air mover 320, cf. FIGS. 3 and4A). Also, a compact computing system in method 500 may include a PSUand an interface structural wall holding an interface panel (e.g., PSU404, interface structural wall 418, and interface panel 206).

Step 510 includes placing the processor assembly on the base unit. Step510 may include attaching fasteners to fixedly couple the processorassembly to the base unit. For example, some embodiments may includeattaching screws onto bosses placed on the base unit. The screws maypass through holes formed in the processor assembly, thus fixedlycoupling the processor assembly to the base unit. In that regard, step510 may include passing a screw through a slot hole in a vertical memberof the processor assembly (e.g., vertical member 408).

Step 520 includes placing the PSU and the interface structural wall onthe base unit. The base unit may include a grooved portion along a topperimeter so that a lower edge of the interface structural wall fits in.Step 520 may include attaching fasteners to fixedly couple the PSU andthe interface panel on the base unit. Accordingly, some embodiments mayinclude using screws as fasteners.

Step 530 includes placing the air mover on top of the processorassembly. As in the previous steps, step 530 may include attachingfasteners to fixedly couple the air mover to the processor assembly.Thus, step 530 may include passing a screw through a slot hole in avertical member of the processor assembly.

Step 540 includes sliding the housing from the topside to the bottomside of the central core to rest on the base unit. The sliding down instep 540 takes place smoothly because a gasket placed on a top interiorportion of the housing (e.g., upper conductive gasket 120, cf. FIG. 1)contacts the upper edge of the central core when the housing travel iscompleted. Also, the sliding down in step 540 may include using thevertical members in the processor assembly as guiding lines. Step 540provides a concentric configuration between the housing and differentcomponents in the central core. In some embodiments, step 540 mayinclude slightly rotating the housing around the central core. Therotation allows finding a guiding lead for a latch guide so that a latchin the housing may engage a locking feature in the central core.

In a particular embodiment, a compact computing system can be assembledusing a bottom up type assembly. Initial assembly operations can includeinstalling a vapor chamber on each side of a triangular central corestructure. In the described embodiments, the vapor chamber can take onthe form of a two phase (vapor/solid) heat spreader. In a particularimplementation, the core can take the form of an aluminum frame securedto and cradled within a fixture. High power components, such as agraphic processor unit (GPU) and/or central processor unit (CPU) can bemounted directly to the vapor chambers.

A good thermal contact can be formed between the vapor chambers and thehigh power components using a thermally conductive adhesive, paste, orother suitable mechanism. A main logic board (MLB) can be pressedagainst a CPU edge connector followed by installation of a GPU flex(es).Once the MLB is seated and connected to the CPU and GPU, memory modulescan be installed after which an inlet assembly can be installed andcoupled to the core structure using fasteners. An input/output (I/O)assembly that has been independently assembled and pre-tested can beinstalled after which a power supply unit (PSU) flex can be connected tothe MLB followed by connecting the DC PSU power using a bus bar system.An exhaust assembly can be installed followed by connecting a RF antennaflex to an I/O assembly. Final assembly can include locking the assemblyfrom top down

FIG. 6A shows a multi-computing system arrangement 600 in accordancewith the described embodiments. Arrangement 600 can include compactcomputing systems 602 in a stacked arrangement in rack 604. In thisconfiguration, each of the compact computing systems can beinterconnected with each other to form a network, for example, compactcomputing systems 602 can be oriented in any number of directions. Asshown in FIG. 6A, compact computing systems 602 are arrangedhorizontally such that air intake/exhaust do not interfere with eachother. In this depiction, cooling air can be pulled in on one side ofrack arrangement 604 and exhausted on another side. In this way exhaustair from one compact computing system is not likely to be re-circulatedinto an intake of a nearby computing system. Compact computing systems602 can be arranged in such a manner can also be in direct communicationvia data connectors 606. Data connectors 606 can be embodied by Ethernetcables, Thunderbolt® cables, or any number of other high speed datatransfer protocol. In some embodiments the depicted compact computingsystems can be in wireless communication. FIG. 6B shows a configurationin which a number of compact computing system are slaved to mastercompact computing system, thereby allowing the master compact computingsystem 610 to allocate resources of the various other compact computingsystems. FIG. 6C shows various other arrangements compatible with thedescribed compact computing systems. For example, “honey comb” rack 620can be used to arrange compact computing systems 602 in a highlyefficient close packed arrangement illustrated in various cross sectionsin FIG. 6D. A perspective view and cross sectional view of oneembodiment are depicted showing a hexagonal arrangement of compactcomputing systems. In another arrangement the compact computing systemscan be arranged in a linear arrangement.

FIG. 7 is a flowchart detailing a process in accordance with thedescribed embodiments. Process 700 is carried out by detecting themovement of the desktop computing system by a sensor at 702 and at 704providing a movement detection signal by the sensor to a processor inaccordance with the movement and altering an operation of the desktopcomputing system in accordance with the movement at 706.

FIG. 8 is a block diagram of a computing system 800 suitable for usewith the described embodiments. The computing system 800 illustratescircuitry of a representative computing system. The computing system 800includes input device 801 coupled to a processor 802 that pertains to amicroprocessor or controller for controlling the overall operation ofthe computing system 800. The computing system 800 stores data (such asmedia data) in a file system 804 and a cache 806. The file system 804typically provides high capacity storage capability for the computingsystem 800. The cache 806 is, for example, Random-Access Memory (RAM)provided by semiconductor memory. The computing system 800 can alsoinclude a RAM 808 and a Read-Only Memory (ROM) 810. The ROM 810 canstore programs, utilities or processes to be executed in a non-volatilemanner.

The computing system 800 also includes a network/bus interface 814 thatcouples to a data link 812. The data link 812 allows the computingsystem 800 to couple to a host computer or to accessory devices. Thedata link 812 can be provided over a wired connection or a wirelessconnection. In the case of a wireless connection, the network/businterface 814 can include a wireless transceiver. The media items (mediadata) can pertain to one or more different types of media content. Inone embodiment, the media items are audio tracks (e.g., songs, audiobooks, and podcasts). In another embodiment, the media items are images(e.g., photos). However, in other embodiments, the media items can beany combination of audio, graphical or visual content. Sensor 816 cantake the form of circuitry for detecting any number of stimuli. Forexample, sensor 816 can include a Hall Effect sensor responsive toexternal magnetic field, an audio sensor, a light sensor such as aphotometer, and so on.

A desktop computing system includes a housing having a variable wallthickness and having a longitudinal axis that defines and encloses aninternal volume that is symmetric about the longitudinal axis and acomputational component positioned within the internal volume.

A computing system includes a housing having a longitudinal axis andthat encloses and defines an internal volume that is symmetric about thelongitudinal axis where the housing is formed of electrically conductivematerial, a computational component, and a base that supports thecomputational component and forms a conductive shell with the housingthat electromagnetically isolates the computational component byblocking passage of electromagnetic (EM) energy.

An enclosure for a computer system includes a housing having alongitudinal axis that encloses an internal volume that is symmetricabout the longitudinal axis and a cross section having a center point onthe longitudinal axis.

An enclosure for a compact computing system having a computationalcomponent includes a cylindrical body that encloses a cylindrical volumehaving a longitudinal axis and comprises an electrically conductivematerial and a cylindrical shaped base attached to the cylindrical bodyin a closed configuration that electrically couples the base and thecylindrical body forming an electromagnetic (EM) shield thatelectromagnetically isolates the cylindrical volume.

An enclosure for a desktop computing system having a computationalcomponent, includes a body that encloses an internal volume formed of anelectrically conductive material, a base unit, and a sensible elementthat is detectable by a sensing mechanism coupled to the computationalcomponent, wherein the detectability of the sensible element by thesensing mechanism corresponds to a state of the enclosure.

A desktop computing system includes a housing having a longitudinal axisthat encloses an internal volume that is symmetric about thelongitudinal axis, a heat sink that encloses at least a central thermalzone that is substantially parallel to the longitudinal axis and havinga cross section having a shape of a polygon, and a computing enginecomprising a computational component disposed within the internal volumeand carried by and in thermal contact with the heat sink.

An enclosure for a desktop computer system includes a cylindrical bodyhaving a longitudinal axis formed of electrically conductive materialthat encloses and defines a cylindrical volume having a circular crosssection comprising a center point positioned on the longitudinal axis.

An enclosure for a compact computing system having a computationalcomponent includes a body that encloses and defines a cylindrical volumeand comprises an electrically conductive material and a base having asize and shape in accordance with and attached to the cylindrical bodyin a closed configuration that electrically couples the base and thecylindrical body forming an electromagnetic (EM) shield thatelectromagnetically isolates the cylindrical volume.

A cylindrical desktop computing system having a computational componentincludes a cylindrical housing having a longitudinal axis that enclosesand defines a cylindrical volume that is symmetric about thelongitudinal axis.

A cylindrical desktop computing system includes a cylindrical housingthat defines a cylindrical volume having a longitudinal axis and acomputational component positioned within the cylindrical volume. Thecylindrical desktop computing system includes a housing wall having avarying housing wall thickness where the cylindrical housing wallthickness comprises a first thickness at a first end of the cylindricalhousing such that the cylindrical housing wall thickness comprises asecond thickness at a second end of the cylindrical housing where thefirst thickness value is less than the second thickness value. In anembodiment, the cylindrical housing comprising a first opening at thefirst end and a second opening at the second end opposite the first endand the first opening is circular having a first diameter and secondopening is circular having a second diameter where second diameter isgreater than the first diameter. In an embodiment, the computationalcomponent transfers heat to air from the first opening that is movingthrough the cylindrical volume and the air moves through the cylindricalvolume generally parallel to the longitudinal axis and the heated airpasses out of the cylindrical volume through the second opening and someof the thermal energy of the heated air is transferred to thecylindrical housing at the second opening.

In an embodiment, the change in cylindrical housing wall thicknesspromotes circumferential and axial diffusion of the thermal energy. Inan embodiment, the circumferential and axial diffusion of the thermalenergy inhibits formation of thermal hot spots in the housing the heatedair has a reduced acoustic signature at the second opening. In oneembodiment, the computational component has a shape having a majorcenterline corresponding to a major dimension and a minor centerlinecorresponding to a minor dimension. In one embodiment, the majordimension corresponding to a major length and the minor dimensioncorresponds to a minor length. In one embodiment, the major dimension isa length (L) and the minor dimension is a width. In one embodiment, themajor dimension is generally parallel to the longitudinal axis. In oneembodiment, the minor dimension is generally parallel to thelongitudinal axis. In an embodiment, a heat sink having planar faces atleast one of which is generally parallel to the longitudinal axis, theplanar faces defining a central region where the central region has atriangular cross section. In an embodiment, an inside surface of thecylindrical housing and an exterior surface of at least one of theplanar faces form a peripheral region spaced apart from the triangularcentral region. In an embodiment, the computational component is mountedto one of the planar faces. In an embodiment, the cylindrical housing isformed of aluminum.

A computing system includes a cylindrical housing formed of electricallyconductive material that defines a cylindrical volume, a computationalcomponent within the cylindrical volume, and a cylindrical base thatsupports the computational component and forms a conductive shell incombination with the cylindrical housing that electromagneticallyisolates the computational component by blocking passage ofelectromagnetic (EM) energy.

In an embodiment, the cylindrical base comprises a pedestal configuredto support the computing system in a vertical orientation and a ventsystem that allows an intake air flow into the cylindrical volume andinhibits the passage of EM energy. In an embodiment, the vent systemincludes vents that can be spaced apart along a circumference of thecylindrical base. In an embodiment, at least some of the vents arespaced apart in a manner that inhibits the passage of EM energy. In anembodiment, at least one of the vents is angled with respect to thecylindrical base in a manner that inhibits a reduction of the intakeairflow regardless of a spatial orientation of the computing system. Inan embodiment, the housing comprises a housing wall formed of thermallyconductive material having a tuned thickness that inhibits formation ofthermal hotspots in the housing by promoting circumferential and axialconduction of thermal energy. In an embodiment, the computing systemfurther includes an electrical connector configured to electricallyconnect the computational component to an external circuit the externalcircuit is part of a second computing system. In an embodiment, thesecond computing system has a spatial orientation different than that ofthe computing system. In an embodiment, the second computing system isnot vertically supported by the pedestal. In an embodiment, the secondcomputing system is rack mounted.

An enclosure for a cylindrical computer system includes a cylindricalhousing that defines a cylindrical volume having a longitudinal axis anda circular cross section having a center point corresponding to aposition on the longitudinal axis and a wall having a wall thicknessthat varies in accordance with the position of the center point on thelongitudinal axis.

In an embodiment, the circular cross section further comprising a radiushaving a radial length, the radius being perpendicular to thelongitudinal axis and the radial length varies in accordance with theposition of the center point of the circular cross section onlongitudinal axis. In an embodiment, the system includes an inner radiushaving a first radial length that defines in part an interior surface ofthe cylindrical housing. In an embodiment, the circular cross sectionincludes an outer radius having a second radial length greater than thefirst radial length that defines in part an exterior surface of thecylindrical housing.

In an embodiment, the wall thickness corresponds to a difference betweenthe outer radial length and the inner radial length. In an embodiment,the inner radius length is a constant value. In an embodiment, whereinthe cylindrical housing is electrically and thermally conductive. In anembodiment, the varying wall thickness promotes axial andcircumferential heat transfer within the cylindrical housing. In anembodiment, the axial and circumferential heat transfer inhibitsformation of thermal hot spots in the cylindrical housing. In anembodiment, the cylindrical housing comprises a first opening at a firstend of the cylindrical housing having a first diameter and a secondopening at a top end opposite the first end having a second diameter. Inan embodiment, the second diameter is less than the first diameter. Inan embodiment, the cylindrical housing wall thickness varies from afirst thickness value near the first opening and a top thickness valuenear the second opening. In an embodiment, the first thickness value isless than the top thickness value. In an embodiment, the system includesa base unit at the first end of the cylindrical housing comprising asupport element that provides support for the computing system. In anembodiment, in a closed configuration, the base unit and the cylindricalhousing cooperate to electromagnetically isolate the cylindrical volume.In an embodiment, the cooperation comprises forming a Faraday cage byelectrically coupling the cylindrical housing and the base unit. In anembodiment, the cylindrical housing is formed of aluminum.

An enclosure for a compact computing system having a computationalcomponent is described. In one embodiment, the enclosure has acylindrical body that defines and encloses a cylindrical volume andincludes a wall formed of an electrically conductive material and acylindrical shaped base attached to the cylindrical body. In a closedconfiguration the base and the cylindrical body are coupled togetherforming an electromagnetic (EM) shield that electromagnetically isolatesthe cylindrical volume.

In an embodiment, the cylindrical body has a circular cross section andincludes a first circular opening having a first diameter at a first endand a second circular opening having a second diameter at a second end.In an embodiment, the cylindrical body further includes an electricallyconductive seal at the first end. In an embodiment, in the closedconfiguration the electrically conductive seal creates an electricallyconducting path between the cylindrical body and the base. In anembodiment, the base includes a pedestal configured to support theenclosure and an opening having a size and shape configured to allowpassage of air and inhibit passage of EM energy where the pedestalsupports the enclosure in a vertical orientation on a horizontalsurface. In an embodiment, the opening includes at least a ventpositioned about a circumference of the cylindrically shaped base in amanner that provides for the passage of the air and that inhibits thepassage of the EM energy.

In an embodiment, a sensing element within the cylindrical volumeconfigured to detect a state of the enclosure, the sensing element beingcoupled to the computational component where the state of the enclosurecomprises a configuration of the enclosure with respect to the base andthe sensing element sends a configuration signal to the computationalcomponent. In an embodiment, the configuration signal causes thecomputational component to operate in a corresponding operating state.In an embodiment, the operating state is a fully operational state onlywhen the configuration signal corresponds to the closed configuration inwhich the base and cylindrical body are attached to each other. In anembodiment, the body further includes a magnetic element that provides amagnetic field detectable by the sensing element.

In an embodiment, the closed configuration corresponds to the sensingelement detecting the magnetic field having a pre-determined magneticfield strength. In an embodiment, the state of the enclosure correspondsto motion of the enclosure with respect to a reference frame detectableby the sensing element. In an embodiment, the sensing element sends amotion detection signal to the computational component when the motionof the enclosure with respect to the reference frame is detected. In anembodiment, the computational component responds to the motion detectionsignal by providing an indication of the detected motion. In anembodiment, the indication is an optical indication.

A method of indicating movement of a desktop computing system bydetecting the movement of the desktop computing system by a sensor,providing a movement detection signal by the sensor to a processor inaccordance with the movement and altering an operation of the desktopcomputing system in accordance with the movement. The movement includesat least one of a rotational movement and a translational movement. Inone embodiment, altering the operation of the desktop computing systemincludes providing an indication of the movement. In one embodiment, theindication of the movement is a visual notification. In one embodiment,the visual notification comprises: illuminating an I/O port inaccordance with an illumination pattern. In one embodiment, the methodincludes providing an illumination control signal by the processor inresponse to the movement detection signal to an I/O interface panelhaving a light emitting diode (LED. In one embodiment, the methodincludes light provided by the LED in response to the illuminationcontrol signal, receiving at least some of the light generated by theLED by a grouping light guide adjacent to the plurality of I/O portsthat guides some of the received light through an opening of an opaquelayer on an outer surface of the I/O interface panel, illuminating theI/O port using at least some of the guided light indicating the movementof the desktop computing system. In one embodiment, a first portion ofthe I/O interface panel is adjacent the grouping light guide and is atleast partially transparent to the light. In one embodiment, a secondportion of the I/O interface panel adjacent the first portion of theinterface panel and adjacent to the at least one I/O port is opaque tothe light.

A network system includes at least two interconnected computing systemshaving a cylindrical shape characterized as having a longitudinal axisand each having a thermal management system connected together in amanner that allows the thermal management system of each computingsystem to maintain a pre-determined thermal performance of eachcomputing system within an operating limit during operation. In oneembodiment, the longitudinal axes of the interconnected computingsystems are perpendicular to each other.

In one embodiment, the longitudinal axes of the interconnected computingsystems are aligned to each other. In one embodiment, the longitudinalaxes of the interconnected computing systems are perpendicular to eachother. In one embodiment, the longitudinal axes of the interconnectedcomputing systems are aligned to each other. In one embodiment, thelongitudinal axes of the interconnected computing systems are aligned toeach other and generally parallel to a horizontal support surface. Inone embodiment, the longitudinal axes of the interconnected computingsystems are aligned to each other and generally parallel to a horizontalsupport surface.

An enclosure for a desktop computing system having a computationalcomponent includes a cylindrical body that encloses a cylindrical volumeand comprises a wall formed of an electrically conductive material, abase unit; and a sensible element that is detectable by a sensingmechanism coupled to the computational component, wherein thedetectability of the sensible element by the sensing mechanismcorresponds to a state of the enclosure.

A desktop computing system includes a cylindrical housing that enclosesa cylindrical volume having a longitudinal axis, a heat sink thatencloses at least a central thermal zone that is substantially parallelto the longitudinal axis and having a triangular cross section, and acomputing engine comprising a computational component disposed withinthe cylindrical volume and carried by and in thermal contact with theheat sink.

An enclosure for a desktop computer system includes a cylindrical bodyformed of electrically conductive material that encloses and defines acylindrical volume having a longitudinal axis and a circular crosssection comprising a center point positioned on the longitudinal axis.

An enclosure for a desktop computing system having a computationalcomponent, includes a body that encloses an internal volume formed of anelectrically conductive material, a base unit, and a sensible elementthat is detectable by a sensing mechanism coupled to the computationalcomponent, wherein the detectability of the sensible element by thesensing mechanism corresponds to a state of the enclosure.

A desktop computing system includes a housing having a longitudinal axisthat encloses an internal volume that is symmetric about thelongitudinal axis, a heat sink that encloses at least a central thermalzone that is substantially parallel to the longitudinal axis, and acomputing engine comprising a computational component disposed withinthe internal volume and carried by and in thermal contact with the heatsink.

An enclosure for a desktop computer system includes a cylindrical bodyhaving a longitudinal axis formed of electrically conductive materialthat encloses and defines a cylindrical volume having a circular crosssection comprising a center point positioned on the longitudinal axis.

An enclosure for a compact computing system having a computationalcomponent includes a body that encloses and defines a cylindrical volumeand comprises an electrically conductive material and a base having asize and shape in accordance with and attached to the cylindrical bodyin a closed configuration that electrically couples the base and thecylindrical body forming an electromagnetic (EM) shield thatelectromagnetically isolates the cylindrical volume.

A desktop computing system having a computational component includes acylindrical housing having a longitudinal axis that encloses and definesa cylindrical volume that is symmetric about the longitudinal axis.

The various aspects, embodiments, implementations or features of thedescribed embodiments can be used separately or in any combination.Various aspects of the described embodiments can be implemented bysoftware, hardware or a combination of hardware and software. Aspects ofthe described embodiments can also be embodied as computer readable codeon a computer readable medium. In some embodiments, the computerreadable code can be used to manufacture and/or assembly for controllingmanufacturing operations or as computer readable code on a computerreadable medium for controlling a manufacturing line. The computerreadable medium is any data storage device that can store data that canthereafter be read by a computer system.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the invention.However, it will be apparent to one skilled in the art that the specificdetails are not required in order to practice the invention. Thus, theforegoing descriptions of specific embodiments of the present inventionare presented for purposes of illustration and description. They are notintended to be exhaustive or to limit the invention to the precise formsdisclosed. It will be apparent to one of ordinary skill in the art thatmany modifications and variations are possible in view of the aboveteachings.

The embodiments were chosen and described in order to best explain theprinciples of the invention and its practical applications, to therebyenable others skilled in the art to best utilize the invention andvarious embodiments with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the following claims and their equivalents.

While the embodiments have been described in terms of several particularembodiments, there are alterations, permutations, and equivalents, whichfall within the scope of these general concepts. It should also be notedthat there are many alternative ways of implementing the methods andapparatuses of the present embodiments. It is therefore intended thatthe following appended claims be interpreted as including all suchalterations, permutations, and equivalents as fall within the truespirit and scope of the described embodiments.

What is claimed is:
 1. An enclosure for a computer system, comprising: ahousing formed of material that is both electrically and thermallyconductive having a varying housing thickness and having a shapecharacterized as having a longitudinal axis and a cross section having acenter point at a position on the longitudinal axis and that encloses aninternal volume that is symmetric about the longitudinal axis.
 2. Theenclosure as recited in claim 1, wherein the cross section is circularand wherein the cross section further comprises a radius that originatesat the center point and is perpendicular to the longitudinal axis. 3.The enclosure as recited in claim 2, wherein the radius furthercomprises: an inner radius that terminates at an interior surface of thehousing and having an inner radial length; and an outer radius thatterminates at an exterior surface of the housing and having an outerradial length greater than the inner radial length.
 4. The enclosure asrecited in claim 3, wherein the housing thickness corresponds to adifference between the outer radial length and the inner radial length.5. The enclosure as recited in claim 4, wherein the outer radial lengthvaries in accordance with the position of the center point on thelongitudinal axis.
 6. The enclosure as recited in claim 1, wherein thevarying housing thickness promotes uniform axial and circumferentialheat transfer in the housing.
 7. The enclosure as recited in claim 6,wherein the uniform axial and circumferential heat transfer inhibitsformation of a thermal hot spot in the housing.
 8. An enclosure for acomputer system, comprising: a housing formed of material that is bothelectrically and thermally conductive having a housing wall having ahousing wall thickness, the housing having a shape characterized by alongitudinal axis and a circular cross section, the circular crosssection having a center point at a position on the longitudinal axis anda radius comprising a first radius that terminates at an exteriorsurface of the housing wall and having a first radial length, and asecond radius that terminates at an interior surface of the housing walland having a second radial length, wherein a housing wall thickness is adifference between the first and second radial lengths and that variesin accordance with the position of the center point on the longitudinalaxis, wherein a first portion of the housing comprises a first endhaving an opening having a size and shape defined by a lip and beingsuitable for passing heated air and comprises a first housing wallthickness and that receives heat from the heated air passing through theopening at least by way of the lip.
 9. The enclosure as recited in claim8, wherein first radial length is a constant value.
 10. The enclosure asrecited in claim 8, wherein the second radial length is a constantvalue.
 11. The enclosure as recited in claim 8, the housing furthercomprising a second portion comprising: a second wall thickness that isless than the first wall thickness and that receives heat from the firstportion.
 12. The enclosure as recited in claim 11, wherein the variationof the housing wall thickness between the first and second portionspromotes uniform axial and circumferential heat transfer through thehousing that further inhibits formation of a thermal hot spot in thehousing.
 13. A computing system, comprising: a cylindrically shapedhousing having a longitudinal axis and formed of a material that is bothelectrically and thermally conductive and having a housing thicknessthat varies smoothly from a first thickness corresponding to a firstposition on the longitudinal axis to a second thickness corresponding toa second position on the longitudinal axis that is away from the firstposition.
 14. The computing system as recited in claim 13, wherein thefirst thickness is greater than the second thickness.
 15. The computingsystem as recited in claim 13, the housing further comprising: a crosssection having a center point at a position on the longitudinal axis andfurther comprising a radius that originates at the center point and isperpendicular to the longitudinal axis.
 16. The computing system asrecited in claim 15, wherein the radius further comprises: an innerradius that terminates at an interior surface of the housing and havingan inner radial length; and an outer radius that terminates at anexterior surface of the housing and having an outer radial lengthgreater than the inner radial length.
 17. The computing system asrecited in claim 16, wherein the housing thickness corresponds to adifference between the outer radial length and the inner radial length.18. The computing system as recited in claim 13, wherein the housingencloses an internal volume that is symmetric about the longitudinalaxis; and a computational component positioned within the internalvolume.